Micro LED Chip Introduction

We focus on design, R&D, manufacturing, testing and sales of Micro-LED chips. We own unique Damage-free Micro-LED chip technology, combined with advanced 3D semiconductor packaging process.

  • Realize non-damaging material transfer for Micro LED
  • Ultra-high luminous efficiency, ultra-high yield rate
  • Core key technology for high-reliability colorization
  • Our team covers expertise across integrated circuits, TFT technologies and LED fields.
Micro LED Chip Wafer

Development Timeline

2023
Patent layout, team building
2024
8-inch hybrid bonding process completed
2026
Mass production of 0.25/0.69 inch full-color chip
2027
Mass output of full-color chip, multi-scenario application
8 inch Hybrid Bonding process developed successfully in 2024
8 inch Hybrid Bonding process developed successfully in 2024
Vehicle HUD
0.61-inch digital automotive lighting module production and delivery
Automotive Headlight
Full-color and red Pixel lighting successfully
Projection Display
Achieving full-color and red mass production and shipment in 2027

Micro LED Chip Market Demand

Micro LED is light and electricity chip interconnection technology. It covers trillion-level projection and consumer markets. Chip pixel size ranges from 2μm ~40μm, including single color & full-color RGB micro LED chips.

Application covers AR glasses, HUD, automotive headlights, projection displays.

Micro LED market diagram

Damage-free Micro LED Core Technology

Our unique Wafer-to-Wafer Hybrid Bonding technology is the core of our damage-free Micro LED chips. The process includes Cu ECP copper electroplating, Cu CMP copper planarization, surface cleaning & activation, and wafer hybrid bonding.

This technology solves major industry bottlenecks: optical crosstalk, computing delay, incomplete ecosystem, interaction experience and extremely high production cost.

It supports mass production for binocular AR glasses and automotive pixel headlights.

Our Micor LED damage free technology

Application Fields

HeBo Smart Headlight

Smart Headlight

Ultra-high brightness automotive digital headlight

 Projection

Projection System

High quality projection display solution

LeYu AR

AR Devices

Augmented reality glasses

ShenShen HUD

ShenShen | HUD

Automotive head-up display

Smart Headlight Series

ItemParameter
ModelLM6141A
ColorWhite
Chip size16.7mm *6.9mm
Light-emitting size15mm*4.4mm
Resolution370 * 110 (40,000 pixels)
Pixel Size40μm
InterfaceSPI
Smart Headlight

Application:
•Adaptive Driving Beam (ADB)
• Intelligent lighting and projection
• Supports interactive functions such as welcome projection, navigation prompts, and accident warnings.
• Capable of dynamically adjusting the light beam according to driving conditions to deliver more flexible lighting performance.

smart Healight LED light 1860 chip 2016 chip 2535 chip 3535 chip

AR GlassesSystem

LeYu AR Glasses

Applications:
• Industry: Deliver real‑time maintenance guidance and operation manuals to boost efficiency.
• Healthcare: Assist in surgical navigation for improved precision and safety.
• Education: Simulate real‑world operating environments to deliver interactive training.
• Consumer & Entertainment: Enable navigation, translation, voice calls, video playback and more.

ItemParameter
ModelLM1231A
ColorSingle color (R/G/B)
Resolution640 * 480 (300,000 pixels)
Pixel Size3.75μm
Chip Size3.8mm*3.3mm
InterfaceQSPI/SPI
Light emitting size 2.5mm*1.9mm

Product Roadmap

Product layout for AR, HUD, automotive headlight and projection display.

Product roadmap

FAQ

What applications are your Micro LED chips suitable for? +
Our Micro LED applications for automotive ADB smart headlights, AR glasses, vehicle HUD and high brightness projection.
What pixel sizes can you supply? +
We offer pixel sizes from 2μm to 40μm, monochrome RGB and white micro LED available.
Can we get samples for project validation? +
Yes. Samples are available for customers for project verification.